楊文彬 教授 簡介

職稱:國立成功大學航空太空工程研究所特聘教授
電話:06-2757575-63672
實驗室網頁:個人網頁

學歷

美國俄亥俄州立大學機械工程研究所 博士 1991
美國俄亥俄州立大學機械工程研究所 碩士 1988
國立臺灣大學機械工程系 學士 1983

經歷

國立成功大學 航太系 教授 1998/08
國立成功大學 航太系 副教授 1991/08至1997/07
美國俄亥俄州州立大學 機械系 研究助理 1987/06至1991/07
國立台灣大學 機械系 助教 1985/08至1986/07

專長及研究領域

覆晶封裝 , 塑膠射出成型 , 微射出成型 , 複材製程模擬 ,
1. Wen-Bin Young , A Two-layer Model for the Simulation of the VARTM Process with Resin Distribution Layer , Applied Composite Materials , 2013 , 20 , pp. 1305-1319 (SCI) 摘要 全文 相關聯結
2. Jyun-yi Chen and Wen-Bin Young , Two-Component Injection Molding Of Molded Interconnect Devices , International Journal of Material Science , 2013 , pp. 920-96 (SCI) 摘要 全文 相關聯結
3. Wen-Bin Young , Three-Dimensional Modeling of the Advanced Grid Stiffened Structures in the Co-curing Process , Composites Part A , 2013 , 46 , pp. 19–25 (SCI) 摘要 全文 相關聯結
4. Connie Yang and Wen-Bin Young , The Effective Permeability of the Underfill Flow Domain in Flip-Chip Packaging , Applied Mathematical Modelling , 2013 , 37 , pp. 1177–1186 (SCI) 摘要 全文 相關聯結
5. Shih-Wei Lin and Wen-Bin Young , Study on Bump Arrangement to Accelerate the Underfill Flow in Flip Chip Packaging , IEEE Transaction on Components Packaging and Manufacturing , 2013 , pp. 40-45 (SCI) 摘要 全文 相關聯結
6. Jyun-yi Chen and Wen-Bin Young , Two-Component Injection Molding Of Molded Interconnect Devices, 2012 International Conference on Manufacturing Engineering and Technology for Manufacturing Growth, San Diego, USA, November , Advanced Materials Research , 2013 , pp. 78-82 (EI)
7. 陳思穎、楊文彬 , 具可變滲透係數之真空輔助樹脂轉注成型充模分析 , 航空太空學會第五十四屆全國學術研討會,新竹 , 2012 (SCI)
8. 沈昭均、楊文彬 , 塑膠射出成型模內電路之結構強度分析 , 航空太空學會第五十四屆全國學術研討會,新竹 , 2012 (SCI) 相關聯結
9. Jyun-yi Chen and Wen-Bin Young , Two-Component Injection Molding Of Molded Interconnect Devices,2012 International Conference on Manufacturing Engineering and Technology for Manufacturing Growth, San Diego, USA, November , Advanced Materials Research , 2012 , Vol. 628 , pp 78-82 (EI)
10. Wen-Hsiang Wu and Wen-Bin Young , Structural Analysis and Design of the Composite Wind Turbine Blade , Applied Composite Materials , 2012 , 19 , pp. 247-257 (SCI) 摘要 全文 相關聯結
11. 劉人豪、楊文彬 , 模內裝飾射出成型製程應用於立體電路板之研究 , 航空太空學會第五十三屆全國學術研討會,台中 , 2011 (SCI)
12. 李在雄、楊文彬 , 風力發電複材葉片之補強纖維分佈及結構設計 , 航空太空學會第五十三屆全國學術研討會,台中 , 2011 (SCI) 相關聯結
13. Wen-Hsiang Wu and W.B. Young , Structural Analysis and Design of the Composite Wind Turbine Blade , 2011 International Conference on Fluid Power and Mechtronics, Beijing, China, August , 2011 (SCI) 相關聯結
14. Connie Yang and W.B. Young , The Underfill Flow in Flip-Chip Packaging , 8th ICMMES International Conference for Mesoscopic Methods in Engineering and Science, Lyon, France, July , 2011 (SCI)
15. Wen-Bin Young , Non-Newtonian Flow Formulation of the Underfill Process in Flip-Chip Packaging , IEEE Transaction on Components Packaging and Manufacturing Technology , 2011 , pp. 2033 - 2037 (SCI) 摘要 全文 相關聯結
16. Chyanbin Hwu, Wen-Bin Young, Dong-Jun Wu and Jiun-Ren Wang , Estimation of Surface Pressure and Strength of Flapping Wing Micro Air Vehicle , Journal of JSEM , 2011 , pp. SS244-SS249 (SCI) 摘要 全文 相關聯結
17. Wen-Bin Young , Effect on Filling Time for a Non-Newtonian Flow During the Underfilling of a Flip Chip , IEEE Transaction on Components Packaging and Manufacturing Technology , 2011 , pp. 1048-1053 (SCI) 摘要 全文 相關聯結
18. Ching-Ho Chang and Wen-Bin Young , Development of a mathematical model for thermal-compression bonding of the COG packaging process using NCA , Microelectronics Reliability , 2011 , pp. 860-865 (SCI) 摘要 全文 相關聯結
19. Huang-Ya Lin, Ching-Ho Chang and Wen-Bin Young , Experimental Study on the Filling of Nano Structures with Infrared Mold Surface Heating , International Polymer Processing , 2011 (SCI) 摘要 相關聯結
20. Huang-Ya Lin, Ching-Ho Chang and Wen-Bin Young , Experimental and Analytical Study on Filling of Nano Structures in Micro Injection Molding , International Communications of Heat and Mass Transfer , 2010 (SCI) 摘要 全文 相關聯結
21. , Application of the Underfill Model to Bump Arrangement and Dispensing Process Design , IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING , 2010 (SCI) 相關聯結
22. , Fabrication of the Plastic Component for Photonic Crystal , Microsystem Technologies , 2010 (SCI) 摘要 相關聯結
23. , Modeling of a non-Newtonian flow between parallel plates in a flip chip encapsulation , MICROELECTRONICS RELIABILITY , 2010 (SCI) 相關聯結
24. , The Filling Behavior of Reinforcing Glass Fiber in Micro Injection Molding , INTERNATIONAL POLYMER PROCESSING , 2010 (SCI) 相關聯結
25. , Analysis of the Isothermal Compression in Nanoimprint Lithography Assuming a Power-Law Fluid , International Polymer Processing , 2008 (SCI)
26. , Micro-injection molding with the infrared assisted mold heating system , Materials Science and Engineering: A , 2007 (SCI)
27. , Analysis of filling distance in cylindrical microfeatures for microinjection molding , Applied Mathematical Modelling , 2007 (SCI)
28. , Underfill of Flip Chip- the Effect of Contact Angle and Solder Bump Arrangement , Advanced Packaging, IEEE Transactions on , 2006 (SCI)
29. , The Thrust and Lift of an Ornithopter's Membrane Wings With Simple Flapping Motion] , Aerospace Science and Technology , 2006 (SCI)
30. , Analysis of the Residual Stresses in the Process of Nanoimprint Lithography , Analysis of the Residual Stresses in the Process of Nanoimprint Lithography , 2005 (SCI)
1. [102] NCA/ACA非導電膠覆晶封裝製程分析模擬II
國科會 (20130801-20140731)
2. [100] NCA/ACA非導電膠覆晶封裝製程分析模擬
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3. [99] 風力風電複材葉片結構設計與最佳化
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4. [99] MID射出成型製程技術之研究與應用
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5. [97] 高分子光子晶體之設計與製作
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8. [94] 奈米壓印製程模擬分析
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10. [92] 具微結構之微射出成型技術研究
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11. [91] 薄壁射出成型件翹曲變形研究(2/2)
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12. [90] 薄壁射出成型件翹曲變形研究(1/2)
國科會 (90.8.1-91.7.31) 中文摘要 英文摘要
1 W.B. Young, K. Rupel, K. Han, L.J. Lee and M.J. Liou, 1991, "Analysis of Resin Injecting Molding in Molds with Preplaced Fiber Mats: II Numerical Simulation and Experiments of Mold Filling", Polymer Composites, 12(1), pp. 30-38. (SCI)

2 W.B. Young, K. Han, L.H. Fong, L.J. Lee and M.J. Liou, 1991, "Flow Simulation in Molds with Preplaced Fiber Mats", Polymer Composites, 12(6), pp. 391-403. (SCI)

3 L. Trevino, K. Rupel, W.B. Young, M.J. Liou, and L.J. Lee, 1991, "Analysis of Resin Injecting Molding in Molds with Preplaced Fiber Mats: I Permeability and Compressibility Measurements", Polymer Composites, 12(1), pp. 20-29. (SCI)

4 W.B. Young, 1994, "Gate Location Optimization in Liquid Composite Molding Using Genetic Algorithms", J. Composite Materials, 28(12), pp. 1098-1113. (SCI)

5 W.B. Young, 1994, "Three Dimensional Nonisothermal Mold Filling Simulation in Resin Transfer Molding", Polymer Composites, 15(2), pp. 118-127. (SCI)

6 W.B. Young, 1994, "A Simplified Flow Model for Resin Transfer Molding of Polymer Composites", Journal of Advanced Materials, 25(3), pp. 60-64. (SCI)

7 W.B. Young and C.W. Tseng, 1994, "Study on the Pre-heated Temperatures and Injection Pressures of the RTM Process", J. of Reinforced Plastics and Composites, 13(5), pp. 467-481. (SCI)

8 L.J. Lee, W.B. Young, and R.J. Lin, 1994, "Mold Filling and Cure Modeling of RTM and SRIM Processes", Composite Structures, 27(1&2), pp. 109-120. (SCI)

9 W.B. Young, 1995, "Thermal Behaviors of the Resin and Mold in the Process of Resin Transfer Molding", J. of Reinforced Plastics and Composites, 14(4), pp. 310-332. (SCI)

10 T.J. Wang, L.J. Lee, and W.B. Young, 1995, "Modification of the Control Volume Finite Element Method for Mold Filling Simulation", Intern. Polymer Processing, 10(1), pp. 82-90. (SCI)

11 W.B. Young, 1995, "Resin Flow Analysis in the Consolidation of Multi-Directional Laminated Composites", Polymer Composites, 16(3), pp. 250-257. (SCI)

12 W.B. Young and S.F. Wu, 1995, "Permeability Measurement of Bidirectional Woven Glass Fibers", J. of Reinforced Plastics and Composites, 14(10), pp. 1108-1120. (SCI)

13 W.B. Young, 1995, "Compacting Pressure and Cure Cycle for the Processing of Thick Composite Laminates", Composites Science and Technology, 54(3), pp. 299-306. (SCI)

14 W.B. Young and M.T. Chuang, 1995, "Fabrication of T-Shaped Structural Composite through Resin Transfer Molding", J. Composite Materials, 29(16), pp. 2192-2214. (SCI)

15 W.B. Young and C.W. Chiu, 1995, "Study on Compression Transfer Molding", J. Composite Materials, 29(16), pp. 2180-2191. (SCI)

16 W.B. Young, 1996, "Consolidation and Cure Simulations for Laminated Composites", Polymer Composites, 17(1), pp. 142-148. (SCI)

17 W.B. Young, 1996, "The Effect of Surface Tension on Tow Impregnation of Unidirectional Fibrous Preform in Resin Transfer Molding ", J. Composite Materials, 30(11), pp.1191-1209. (SCI)

18 W.B. Young and C.W. Chang, 1996, "Experimental Investigation on Blade-Stiffened Panel with Stiffener-to-Skin Stitching," AIAA, Technical Note, 34(9), pp. 1964-1966. (SCI)

19 M.H. Chang, C.L. Chen, and W.B. Young, 1996, “Optimal Design of the Cure Cycle for Consolidation of Thick Composite Laminates”, Polymer Composites, 17(5), pp. 743-750. (SCI)

20 H.W. Yu and W.B. Young, 1997, "Optimal Design of Process Parameters for Resin Transfer Molding ", J. Composite Materials, 31(11), pp. 1113-1140. (SCI)

21 W.B. Young and C.L. Lai, 1997, “Analysis of the Edge Effect in Resin Transfer Molding”, Composites Part A: applied science and manufacturing, 28A, pp. 817-822. (SCI)

22 C.L. Lai and W.B. Young, 1997, “Model Resin Permeation of Fiber Reinforcements after Shear Deformation”, Polymer Composites, 18(5), pp. 642-648. (SCI)

23 C.L. Lai and W.B. Young, 1999, “The Effects of Preforming Induced Variable Permeabilities on the RTM Molding Flow”, Polymer Composites, 20(2), pp. 225~239. (SCI)

24 J.L. Lin and W.B. Young, 1999, “The Effect of Preheater on the Resin Transfer Molding”, J. of Reinforced Plastics and Composites, 18(10), pp. 954~965. (SCI)

25 C.L. Lai and W.B. Young, 1999,"Modeling the Fiber Slippage During Preforming Process", Polymer Composites, 20(4), pp. 594~603. (SCI)

26 C.M. Chen and W.B. Young, 2000, "The Effects of Compression Pressure on Injection Compression Molding", International Polymer Processing, 15(2), pp. 176-179. (SCI)

27 W.B. Young, 2000,"Filling and Postfilling Analysis of Injection/Compression Molding", International Polymer Processing, 15(4), pp. 416-422. (SCI)

28 Z.S. Gao and W.B. Young, 2002, "Study of the Bending Induced Gap in Fiber Preforming of Woven Fiber Mats", Polymer Composites, 23(2), pp. 239~248. (SCI)

29 W.B. Young and A. Chen, 2002, “The Effect of Compression Pressure on Compression Transfer Molding”, Transactions of the Aeronautical and Astronautical Society of the Republic of China, 34(1), pp. 39~44. (EI)

30 W.B. Young and M.Z. Wu, 2002,“Applying the Neural Network Method to the Design of the Processing parameters in Liquid Composite Molding”, Transactions of the Aeronautical and Astronautical Society of the Republic of China, 34(3), pp. 189~195. (EI)

31 T.H. Wang, W.B. Young, and J. Wang, 2002,“Process Design for Reducing the Warpage in Thin-walled Injection Molding”, International Polymer Processing, 17(2), pp. 146~152. (SCI)

32 W.B. Young and J. Wang, 2002, “Residual Stress and Warpage Models for Complex Injection Molding”, International Polymer Processing, 17(3), pp. 271~278. (SCI)

33 W.B. Young and W.L. Yang, 2002, “Underfill Viscous Flow between Parallel Plates and Solder Bumps”, IEEE Transaction on Components and Packaging Technology, 25(4), pp. 695~700. (SCI)

34 W.B. Young and W.L. Yang, 2002, “The Effect of Solder Bump Pitch on the Underfill Flow”, IEEE Transaction on Advanced Packaging, 25(4), pp. 537~542. (SCI)

35 W.B. Young, 2003, “On the Residual Stress and Shrinkage in Injection Compression Molding”, International Polymer Processing, 18(3), pp. 313~320. (SCI)

36 W.B. Young, 2003, “Anisotropic Behavior of the Capillary Action in Flip Chip Underfill”, Microelectronics Journal, 31(11), pp. 1031~1036. (SCI)

37 W.B. Young, 2004, “Residual Stress Induced by Solidification of Thermoviscoelastic Melts in the Postfilling Stage”, Journal of Materials Processing Technology, 145(3), pp 317~324. (SCI)

38 C.L. Lai and W.B. Young, 2004, “A Model for Underfill Viscous Flow Considering the Resistance Induced by Solder Bumps”, Journal of Electronic Packaging, 126(2), pp. 186~194. (SCI)

39 W.B. Young, 2004, “Three Dimensional Analysis of Shape Deformation in Injection Molded Optical Lens”, International Polymer Processing, 19(1), pp 70~76. (SCI)

40 W.B. Young, 2004, “Capillary Impregnation into Cylinder Bank”, Journal of Colloid and Interface Science, 273(2), pp.576~580. (SCI)

41 W.B. Young, 2004, “Analysis of Capillary Flows in Non-Uniform Cross-Sectional Capillaries”, Colloids and Surfaces A Physicochemical and Engineering Aspects, 234, pp. 123~128. (SCI)

42 S.P. Yang and W.B. Young, 2004, “Microinjection Molding with LIGA-Like Process”, International Polymer Processing, 19(2), pp. 180~185. (SCI)

43 W.B. Young, 2005, “Simulation of the Filling Process in Molding Components with Micro Channels”, Microsystem Technologies, 11(6), pp. 410~415. (SCI)

44 W.B. Young, 2005, “Analysis of the Nanoimprint Lithography with A Viscous Model”, Microelectronic Engineering, 77, pp. 405~411. (SCI)

45 W.B. Young, 2005, “Effect of Process Parameters on Injection Compression Molding of Pickup Lens”, Applied Mathematical Modelling, 29(10), pp. 955-971. (SCI)

46 H.C, Chang and W.B. Young, 2005, “Experimental Study on the Filling of a Micro Injection Molding with Cylindrical Dot Patterns”, International Polymer Processing, 20(3) pp. 245~249.. (SCI)

47 T.H. Wang and W.B. Young, 2005, “Study on Residual Stresses of Thin-walled Injection Molding”, European Polymer Journal, 41(10), pp. 2511~2517. (SCI)

48 C.S. Lin, C. Hwu, W.B.Young, (2006), The Thrust and Lift of an Ornithopter’s Membrane Wings With Simple Flapping Motion, Aerospace Science and Technology. to appear (SCI)

49 W.B.Young, (2006), Analysis of the Residual Stresses in the Process of Nanoimprint Lithography, International Polymer Processing. to appear (SCI)

50 W.B. Young and W.L. Yang, (2006), Underfill of Flip Chip: the Effect of Contact Angle and Solder Bump Arrangement, IEEE Transaction on Advanced Packaging to appear. (SCI)

51 W.B. Young, (2007), Analysis of Filling Distance in Cylindrical Micro Features for Micro Injection Molding, Applied Mathematical Modeling 31(9) pp. 1798-1806. (SCI)

52 M.C. Yu, W.B. Young, P.M. Hsu, (2007), Micro Injection Molding with the Infrared Assisted Mold Heating System, Materials Science & Engineering A 460-461 pp. 288-295. (SCI)

53 I.C. Hsin and W.B. Young, (2008), Analysis of the Isothermal Compression in Nanoimprint Lithography Assuming a Power-Law Fluid, International Polymer Processing 23(1) pp. 24~29. (SCI, 0.521)

54 W.B. Young, (2009), Development of a Helicopter Landing Gear Prototype Using Resin Infusion Molding, J. of Reinforced Plastics and Composites 28(7) pp. 833-849. (SCI, 0.573)

55 Huang-Ya Lin and Wen-Bin Young, (2009), Analysis of the Filling Capability to the Microstructures in Micro Injection Molding, Applied Mathematical Modelling 33(9) pp. 3746-3755. (SCI. 0.931)

56 Jian-Hong Li and Wen-Bin Young, (2009), Study on Mold Filling Behaviors of Micro Channels in Injection Molding, International Polymer Processing 24(5) pp. 421-427. (SCI, 0.521)

57 Meng-Fu Shih and Wen-Bin Young, (2009), Experimental Study of Filling Behaviors in the Underfill Encapsulation of a Flip Chip, Microelectronics Reliability 49 pp. 1555-1562. (SCI, 1.29)

58 Ching-Ho Chang and Wen-Bin Young, (2010), Fabrication of the Plastic Component for Photonic Crystal Using Micro Injection Molding, Microsystem Technologies, 16 pp. 941-946. (SCI)

59 Sin-Wei Peng and Wen-Bin Young, (2010), Application of the Underfill Model to Bump Arrangement and Dispensing Process Design, IEEE Transactions on Electronics Packaging Manufacturing, 33(2) pp. 122-128. (SCI)

60 Wen-Bin Young, (2010), Modeling of a Non-Newtonian Flow between Parallel Plates in a Flip Chip Encapsulation, Microelectronics Reliability, 50 pp. 995-999. (SCI)

61 Guan-Lin Liou and Wen-Bin Young, (2010), The Filling Behavior of Reinforcing Glass Fiber in Micro Injection Molding, International Polymer Processing 25(4) pp. 264-269. (SCI)

62 Huang-Ya Lin, Ching-Ho Chang and Wen-Bin Young, (2010), Experimental and Analytical Study on Filling of Nano Structures in Micro Injection Molding, International Communication of Heat and Mass Transfer, 37(10) pp. 1477-1486.

63 Huang-Ya Lin, Ching-Ho Chang and Wen-Bin Young, (2011), Experimental Study on the Filling of Nano Structures with Infrared Mold Surface Heating, International Polymer Processing, 26(1) pp. 73-81. (SCI)

64 Ching-Ho Chang and Wen-Bin Young, (2011), Development of a mathematical model for thermal-compression bonding of the COG packaging process using NCA, Microelectronics Reliability, 51 pp. 860-865. (SCI)

65 Wen-Bin Young, (2011), The Effect on Filling Time for a Non-Newtonian Flow During the Underfilling of a Flip Chip, IEEE Transaction on Components Packaging and Manufacturing Technology, 1(7) pp. 1048-1053 (SCI)

66 Wen-Hsiang Wu and Wen-Bin Young, (2011), Structural Analysis and Design of the Composite Wind Turbine Blade, Applied Composite Materials, to appear. (SCI)
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